Intel Corporation (NASDAQ:INTC) has disclosed recently its new tiny 3G modem, XMM™ 6255, which is designed to provide wireless connectivity for devices in the Internet of Things segment. The new modem has a size of around 300 square milimeters, which, according to the company, will make it a suitable feature on networked sensors and various devices from the Internet of Things such as security, and industrial equipment devices, Intel Corporation (NASDAQ:INTC) said in a post on its official blog.
The new modem has a SMARTI™ UE2p transceiver, built on Intel Corporation (NASDAQ:INTC)’s Power Transceiver technology. The company said that the product features transmit & receive functionality, and has a power amplifier and power management, all of which is build on a single chip. The design of the modem aims to require fewer components, which leads to a smaller size and therefore will decrease the material costs for manufacturers, Intel Corporation (NASDAQ:INTC) added. Among other things, the new modem is protected from overheating, voltage peaks and damage caused by tough external conditions.