Intel Corporation (INTC)’s New Technologies Target Cost Reduction and Time to Market

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Intel Corporation (NASDAQ:INTC) announced two new packaging and test technologies for their custom foundry customers on Wednesday. These technologies are more cost effective compared to the traditional methods. Intel elaborated on the new technologies in a press release.

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Intel Corporation (NASDAQ:INTC)’s two new technologies are Embedded Multi-die Interconnect Bridge (EMIB) and High Density Modular Test (HDMT). EMIB enables a much lower cost and a simpler packaging process for high density interconnects between heterogeneous dies, the company added.

EMIB saves a lot of cost for the Intel Corporation (NASDAQ:INTC)’s foundry customers by replacing the traditional expensive TSV silicon interposer with a silicon chip bridge, which is small and embedded in the package. TSVs are more costly and more complex as well, hence EMIB makes the process simpler and cheaper.

“The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions,” VP and Director of Assembly and test technology development for Intel, Babak Sabi was quoted as saying about EMIB.

HDMT is a new revolutionary test technology platform, which targets various products in variety of markets like server, client, system on chip and Internet of things. This technology was available for Intel Corporation (NASDAQ:INTC)’s internal products only. Intel has announced that this technology will be open to Intel foundry customers.

“We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production,” Sabi was quoted as saying about HDMT.

Intel Corporation (NASDAQ:INTC) also announced that EMIB will be available to foundry customers from 2015, but HDMT will be available immediately to foundry customers.

Among the top shareholders of Intel Corporation (NASDAQ:INTC) is Fisher Asset Management, led by Ken Fisher. Fisher Asset Management hold around 19 million shares of the company.

Disclosure: None

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